Advanced Packaging Lead

Delft30+ days ago

Full-timeHybridIn English

About the job

Quantware is seeking an Advanced Packaging Lead to drive the development of back-end fabrication and assembly technologies. Based in Delft, this role focuses on enhancing flip chip bonding techniques and establishing scalable integration procedures.

What you will do

Plan and lead development of back-end fabrication and assembly technologies
Enhance flip chip bonding techniques, contacts reliability, and manufacturability
Develop and coordinate integration test plans with cross-functional teams
Lead definition and formalization of assembly-centric fabrication and process development
Establish scalable, well-documented integration procedures
Investigate and resolve integration issues and technical anomalies

What you bring

4+ years experience in chip assembly development of deep-tech or low-volume technology
Preferably flip chip experience in quantum computing
Hands-on experience with back end process-flow development
Experience with UBM, hard-stops, bumps, detachable contacts, MEMS, flip-chip technologies
Background in physics, microwave, RF, or electrical engineering, or related field

Nice to have

Background in superconducting qubits
PhD in a related field

What you get

Competitive salary with 8% holiday allowance
Generous pension plan with partner and dependent coverage
Flexible hybrid work setup
Open vacation policy
Personal learning and development budget
Team events and offsites

Summary by Personeel.com. The full job description and the application form are on Quantware's website (jobs.ashbyhq.com); Apply takes you straight there.

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